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  ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 1 benefts ? f-tech and 100% sbds (kemet's patented simulated b reakdown voltage screening) ? 3 si gma screening for il, df and esr ? qualifed a t 1 ,000 h ours o f l ife t est a t 2 30c a t 0 .33 v r ? voltage d erating o f 6 7% a t 2 30c ? un ique high temperature material set ? me ets or exceeds eia standard 535baac ? st andard gold-plated terminations ? ro hs compliant ? operating t emperature r ange o f ? 55oc t o + 230oc ? vo ltage derating applies ? ta ped and reeled per eia 481 ? me ets msl 1 requirements for pb-free assembly according to jedec jCstdC020 ? pa ckaged in moisture barrier bags with desiccant and a humidity indicator card ? su rge current options available overview the kemet t502 series is a high temperature product that offers optimum performance characteristics in applications w ith o perating t emperatures u p t o 2 30c. th is s eries i s c lassifed a s m oisture s ensitivity l evel ( msl) 1 u nder j s td 0 20: u nlimited f oor l ife t ime a t 3 0c/85% rh. d ue to the potential use of high melting point solders, kemet has taken the initiative to package this series in moisture barrier bags with desiccant and a humidity indicator card. tantalum surface mount capacitors C high temperature t502 series mno 2 230c applications typical applications include decoupling and fltering for very high temperature environments such as measurement-while- dr illing (mwd) in down-hole applications. k-sim for a detailed analysis of specifc part numbers, please visit ksim.kemet.com to access kemets k-sim software. kemet k- sim is designed to simulate behavior of components with respect to frequency, ambient temperature, and dc bias levels. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 2 2 ordering information t 502 d 685 m 035 a g 61 10 capacitor class series case size capacitance code (pf) capacitance tolerance rated voltage (vdc) failure rate/ design termination finish performance esr t = tantalum high temperature 230c b d first two digits represent signifcant fg ures. t hird di git s pecifes nu mber of zeros. k = 10% m = 20% 016 = 16 025 = 25 035 = 35 a = n/a g = gold plated 61 = surge none 62 = s urge a t 2 5c 63 = s urge ? 55c a nd + 85c 10 = standard esr performance characteristics item performance characteristics operating temperature ?55c t o 2 30c rated capacitance range 6.8 C 1 0 f a t 1 20 h z/25c capacitance tolerance k tolerance (10%), m tolerance (20%) rated voltage range 16 C 35 v df (120 hz) refer t o p art n umber e lectrical s pecifcation t able es r (100 khz) refer t o p art n umber e lectrical s pecifcation t able le akage current 0 .01 c v ( a) a t r ated v oltage a fter 5 m inutes tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 3 3 qualifcation test condition characteristics endurance 230c a t 1 /3 r ated vo ltage, 1 ,000 h ours c /c within 10% of initial value df within 1.5 x initial limits dcl 1 mamp maximum esr within 2.0 x initial limits storage life 230c a t 0 vo lts, 1 ,000 h ours c /c within 10% of initial value df within 1.5 x initial limits dcl 1 mamp maximum esr within 2.0 x initial limits humidity 85c, 8 5% r h, 0 v , 5 00 h ours c /c within 10% of initial value df within initial limits dcl within initial limits esr within initial limits temperature stability extreme temperature exposure at a succession o f c ontinuous s teps a t + 25c, ?5 5c, + 25c, + 85c, + 150c, + 25c +25c ?55c +85c +150c c /c il* 10% 10% 20% df il il 1.5 x il 1.5 x il dcl il n/a 10 x il 12 x il mechanical shock/ vibration milCstdC202, method 213, condition i, 100 g peak milCstdC202, method 204, 10 hz to 2,000 hz, 5g's for 20 minutes, 12 cycles each of 3 orientations c /c within 10 of initial value df within initial limits dcl within initial limits *il = initial limit tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 4 4 electrical characteristics impedance & esr vs. frequency the measurements were taken at room temperature (25c) capacitance vs. frequency the measurements were taken at room temperature (25c) impedance, esr (ohms) frequency (hz) 000 00 0 0 00 000 0000 00000 000000 0000000 5025035m 5025035s 50200m 50200s 10 100 0.1 capacitance (f) frequency (hz) 100 1,000 10,000 100,000 1,000,000 10,000,000 1 502d685k035_cap(f) 502b106k016_cap(f) tantalum surface mount capacitors ? high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 5 5 dimensions C millimeters h x t b b g f e a l r p side view anode (+) end view bottom view cathode (-) end view w s s termination cutout at kemet's option, either end case size component total weight kemet eia l w h f s b (ref) x (ref) p (ref) r (ref) t (ref) a (min) (mg) b 3528-21 3.5 0.2 (0.138 0.008) 2.80.2 (0.1100.008) 1.90.2 (0.0750.008) 2.20.1 (0.0870.004) 0.80+0.1/?0.3 (0.032+0.004/?0.011) 0.40.15 (0.0160.006) 0.100.10 (0.0040.004) 0.5 (0.020) 1.0 (0.039) 0.13 (0.005) 1.9 (0.075) 63 d 7343-31 7.3 0.3 (0.287 0.012) 4.30.3 (0.1690.012) 2.80.3 (0.1100.012) 2.40.1 (0.0940.004) 1.30.3 (0.051 0.012) 0.50.15 (0.0200.006) 0.100.10 (0.0040.004) 0.9 (0.035) 1.0 (0.039) 0.13 (0.005) 3.8 (0.150) 292 notes: (ref) C dimensions provided for reference only. these weights are provided as reference. if exact weights are needed, please contact your kemet sales representative table 1 C ratings & part number reference rated voltage rated cap case code/ case size kemet part number dc leakage df esr maximum allowable ripple current maximum operating temp vdc at 85c f kemet/eia (see below for part options) a at 25c max/5 minutes % at 25c 120 hz max at 25c 100 khz max ma at +45c 100 khz c 16 10 b/3528-21 t502b106(1)016ag(2)10 1.6 6 2.8 174 230 25 10 d/7343-31 t502d106(1)025ag(2)10 2.5 6 1.8 289 230 35 6.8 d/7343-31 t502d685(1)035ag(2)10 2.4 6 1.8 289 230 (1) to complete kemet part number, insert m for 20% or k for 10%. designates capacitance tolerance. (2) to complete kemet part number, insert 61 = none, 62 = 10 cycles +25c, 63 = 10 cycles ?55c +85c designates surge current option. refer to ordering information for additional detail. tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 6 6 recommended voltage derating guidelines 0% 10% 20% 30% 40% 50% 60% ? 55 25 85 125 175 200 215 230 % rated voltage temperature (oc) 33% rated voltage working voltage 25c 85c 125c 200c 215c 230c 16 16 16 13.1 7.5 6.4 5.3 25 25 25 20.5 11.8 10 8.3 35 35 35 28.7 16.5 14 11.6 note: additional reliability can be obtained through the derating of voltage ripple current/ripple voltage permissible ac ripple voltage and current are related to equivalent series resistance (esr) and the power dissipation capabilities of the device. permissible ac ripple voltage which may be applied is limited by two criteria: 1. t he positive peak ac voltage plus the dc bias voltage, if any, must not exceed the dc voltage rating of the capacitor. 2. t he negative peak ac voltage in combination with bias voltage, if any, must not exceed the allowable limits specifed f or r everse v oltage. s ee th e r everse v oltage sec tion for allowable limits. the maximum power dissipation by case size can be determined using the table at right. the maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. refer to the table below for temperature compensation requirements. temperature compensation multipliers for maximum ripple current t 200c 200 220c 220 230c t = environmental temperature kemet case code eia case code maximum power dissipation (p max) mwatts at 25c w/+20c rise b 3528C21 85 d 7343C31 150 the maximum power dissipation rating must be reduced with increasing environmental operating temperatures. refer to the temperature compensation multiplier table for details. using the p max of the device, the maximum allowable rms ripple current or voltage may be determined. -qe p max/r )e p max/r i = rms ripple current (amperes) e = rms ripple voltage (volts) p max = maximum power dissipation (watts) 6)6exwtimihviuyirslw tiheriexwtimihviuyirslw tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 7 7 reverse voltage solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. t he p ositive t erminal i s i dentifed o n th e c apacitor b ody b y a s tripe, p lus i n so me c ases a b eveled e dge. a s mall de gree of transient reverse voltage is permissible for short periods per the below table. the capacitors should not be operated continuously in reverse mode, even within these limits. temperature permissible transient reverse voltage 25c 15% of rated voltage 85c 5% of rated voltage 125c 1% of rated voltage 8efpii0erh(mqirwmsrw'syvxevh /)1)8 1ixvmg 7mi 'shi (irwmx0izip% maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) case eia w l s v1 v2 w l s v1 v2 w l s v1 v2 b 3528C21 2.35 2.21 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24 d 7343C31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component desity product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). 1 height of these chips may create problems in wave soldering. 2 land pattern geometry is too small for silkscreen outline. l s w w l v1 v2 grid placement courtyard tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 8 8 time te mp erature t smin 25 t smax t l t p maximum ramp up rate = 3oc/sec maximum ramp down rate = 6oc/sec t p t l t s 25oc to peak soldering process kemets families of surface mount capacitors are co mpatible with wave (single or dual), convection, ir, or v apor p hase r efow t echniques. p reheating o f th ese co mponents is recommended to avoid extreme thermal stress. k emet's r ecommended p rofle c onditions f or co nvection a nd i r r efow r efect th e p rofle c onditions o f th e ip c/jCstdC020d standard for moisture sensitivity testing. the devices can safely withstand a maximum of three refow p asses a t th ese c onditions. note that although the x/7343C43 case size can withstand wave s oldering, th e t all p rofle ( 4.3 m m m aximum) d ictates ca re in wave process development. hand soldering should be performed with care due to the diffculty i n p rocess c ontrol. i f p erformed, c are s hould b e ta ken to avoid contact of the soldering iron to the molded case. the iron should be used to heat the solder pad, applying solder between the pad and the termination, until refow o ccurs. o nce r efow o ccurs, th e i ron s hould b e re moved immediately. wiping the edges of a chip and heating the top surface is not recommended. profle feature snpb assembly pb-free assembly preheat/soak temperature minimum (t smin ) 100c 150c temperature maximum (t smax ) 150c 200c time (t s ) from t smin to t smax ) 60 C 120 seconds 60 C 120 seconds ramp-up rate (t l to t p ) 3c/seconds ma ximum 3c/seconds ma ximum liquidous temperature (t l ) 183c 217c time above liquidous (t l ) 60 C 150 seconds 60 C 150 seconds peak temperature (t p ) 220c* 235c** 250c* 260c** time within 5c of maximum peak temperature (t p ) 20 seconds maximum 30 seconds maximum ramp-down rate (t p to t l ) 6c/seconds ma ximum 6c/seconds ma ximum time 25c to peak temperature 6 minutes maximum 8 minutes maximum note: all temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly refow. *case size d, e, p, y, and x **case size a, b, c, h, i, k, m, r, s, t, u, v, w, and z storage tantalum chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperature reels may soften or warp and tape p eel f orce m ay i ncrease. k emet r ecommends th at m aximum s torage t emperature n ot e xceed 4 0oc a nd m aximum st orage h umidity n ot e xceed 6 0% r elative h umidity. t emperature f uctuations s hould b e mi nimized t o a void c ondensation on th e parts and atmospheres should be free of chlorine and sulphur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within three years of receipt. tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 9 9 construction leadframe (? cathode) leadframe (+ anode) tantalum wire molded epoxy case molded epoxy case polarity bevel (+) weld (to attach wire) tlps washer polarity stripe (+) detailed cross section tantalum wire tantalum ta 2 o 5 dielectric (first layer) carbon (third layer) nickel plating (fourth layer) washer mno 2 (second layer) capacitor marking kemet high temperature mno 2 polarity indicator (+) rated voltage picofarad code kemet id date code* * 540 = 40 th week of 2015 date code * 1 st digit = last number of year 5 = 2015 6 = 2016 7 = 2017 8 = 2018 9 = 2019 2 nd and 3 rd digit = week of the year 01 = 1 st week of the year to 52 = 52 nd week of the year tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 10 10 tape & reel packaging information kemets molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with eia standard 481 : embossed carrier taping of surface mount components for automatic handling. this packaging system is compatible with all tape-fed automatic pick-and-place systems. table 3 C packaging quantity case code tape width (mm) 7" reel* 13" reel* kemet eia s 3216-12 8 2,500 10,000 t 3528-12 8 2,500 10,000 m 3528-15 8 2,000 8,000 u 6032-15 12 1,000 5,000 l 6032-19 12 1,000 3,000 w 7343-15 12 1,000 3,000 z 7343-17 12 1,000 3,000 v 7343-20 12 1,000 3,000 a 3216-18 8 2,000 9,000 b 3528-21 8 2,000 8,000 c 6032-28 12 500 3,000 d 7343-31 12 500 2,500 q 7343-12 12 1,000 3,000 y 7343-40 12 500 2,000 x 7343-43 12 500 2,000 e/t428p 7360-38 12 500 2,000 h 7360-20 12 1,000 2,500 * no c-spec required for 7" reel packaging. c-7280 required for 13" reel packaging. top tape thickness 0.10 mm (0.004") maximum thickness 8 mm (0.315") or 12 mm (0.472") 180 mm (7.0") or 330 mm (13.0") tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 11 11 figure 1 C embossed (plastic) carrier tape dimensions po t f w cent er line s of ca vity ao bo user direction of unre eling cover tape ko b 1 is for tape feeder reference only, including dra ft concentric abou t b o . t 2 ?d 1 ?do b 1 s 1 t 1 e 1 e 2 p 1 p 2 embossment for c avity size, see note 1 table 4 [10 pitches cumulative tolerance on tape 0.2 mm] 8efpii)qfswwih 4pewxmg 'evvmiv8eti(mqirwmsrw metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5+0.10/?0.0 (0.059+0.004/?0.0) 1.0 (0.039) 1.750.10 (0.0690.004) 4.00.10 (0.1570.004) 2.00.05 (0.0790.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm 2.00.1 (0.0790.059) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape, with or without components, shall pass around r without damage (see figure 4). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481Cd, paragraph 4.3, section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 3). (e) see addendum in eia standard 481Cd for standards relating to more precise taping requirements. variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 , b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.50.05 (0.1380.002) 2.00.05 or 4.00.10 (0.0790.002 or 0.1570.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.50.05 (0.2170.002) 2.00.05 (0.0790.002) or 4.00.10 (0.1570.004) or 8.00.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16 mm triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.10 (0.2950.004) 4.00.10 (0.1570.004) to 12.00.10 (0.4720.004) 8.0 (0.315) 16.3 (0.642) tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 12 12 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 2 C maximum component rotation ao bo t s max imum c ompon en t rota ti on t op view maxi mum co mponent rotat ion s id e view tape m ax imum width (mm) r otat io n ( t ) 8,12 20 16 ? 200 10 tap e m aximum wid th ( mm) ro tat ion ( s ) 8,12 20 16 ? 56 10 72 ? 200 5 typical pocke t center line typical com po nent centerline figure 3 C maximum lateral movement 0.5 mm maxi mum 0.5 mm maxi mum 8 mm & 1 2 mm tap e 1.0 mm maxi mum 1.0 mm maxi mum 1 6 mm tape figure 4 C bending radius r r b en ding radius e mbo sse d carrier p unc hed ca rrier tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 13 13 figure 5 C reel dimensions a d (see note) full radi us, see note b (see note) access hole at slot location (? 40 mm minimum) if present, tape slot in core for t ap e start: 2.5 mm minimum width x 10.0 mm minimum depth w3 (includes flange distortion at outer edge) w2 (m ea sured at hu b) w1 (m ea sured at hu b) c (arbor hole diameter) note: drive spokes optional; if used, dimensions b and d shall apply. n 8efpii6iip(mqirwmsrw metric will govern constant dimensions millimeters (inches) tape size a b minimum c d minimum 8 mm 1780.20 (7.0080.008) or 3300.20 (13.0000.008) 1.5 (0.059) 13.0+0.5/?0.2 (0.521+0.02/?0.008) 20.2 (0.795) 12 mm 16 mm variable dimensions millimeters (inches) tape size n minimum w 1 w 2 maximum w 3 8 mm 50 (1.969) 8.4+1.5/?0.0 (0.331+0.059/?0.0) 12.4+2.0/?0.0 (0.488+0.078/?0.0) 16.4+2.0/?0.0 (0.646+0.078/?0.0) tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 14 14 figure 6 C tape leader & trailer dimensions trailer 16 0 mm minimum carrier t ape end start rou nd sp rock et holes el ongated spro ck et holes ( 32 mm tape and wi de r) t op co ve r t ape top c ove r t ape p unche d carrier 8 mm & 12 mm only e mboss ed carrier components 100 mm minimum leader 400 mm minimum figure 7 C maximum camber carrier tape round sprocket holes 1 mm ma ximum , either direction straight edge 250 mm elongated sprocket holes (32 mm & wider ta pe s) tantalum surface mount capacitors C high temperature t502 series mno 2 230c
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com t2 075_t502 ? 10/21/2016 15 15 kemet electronic corporation sales off ces for a complete list of our global sales off ces, please visit www.kemet.com/sales. disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. kemet is a registered trademark of kemet electronics corporation. tantalum surface mount capacitors C high temperature t502 series mno 2 230c


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